binder creates flexible hybrid solution for complex applications

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New M12-A connector combines power and signal contacts

binder, a leading manufacturer of industrial circular connectors, announces the first models in a new range of overmoulded M12 A-coded connectors. Its hybrid design means the single-cable solution contains both power and signal contacts

The versatility and flexibility of the new hybrid connectors makes them ideal for  applications in industrial indoor and outdoor areas where both power and signal transmission is needed in the smallest of spaces. In addition to sensors, actuators and camera systems, this also includes motors, drives and control systems.

Current and signal properties

The first available versions feature nine contacts –  two gold-plated current contacts rated to 12A at 63 V and seven gold-plated signal contacts rated 0.5 A at 12.5 V.

The power conductors are inserted in a cable connector moulded with polyurethane (PUR) and feature a cross section of 0.75mm2 (AWG 18). The signal transmission conductors are 0.14 mm2 (AWG 26).

As standard, the new connectors are supplied with 2m and 5m cables although custom cables lengths are also available from binder on request. For PCB applications, the connection to the printed circuit board is implemented using dip soldering technology (THR) for the power contacts and SMD technology for the signal contacts. The connectors can be processed in modern reflow processes.

 

 

 

 

Practical application and further development of the offer

The connector has been specifically designed for demanding outdoor applications. When mated, the connectors protect to IP67 and the operating temperature range is -25 °C to 85 °C. The screw connection of the M12x1 standard thread is made of stainless steel although an optional plastic version is available.

binder is also announcing a connector variant with six contacts among the other models that will soon follow. This combines two current contacts – up to 16A – and four shielded signal contacts for data transmission. This enables future DC applications with power requirements of up to a maximum of 1kW and with simultaneous data connection up to 100Mbit /s.

Smiths High frequency chip equalizers offer excellent slope linearity

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Smiths Interconnect’s new CEX series provides optimized solutions for gain variation over frequency.

Smiths Interconnect, a leading provider of technically differentiated electronic components, subsystems, microwave and radio frequency products announced the release of its new CEX Series of High Frequency Surface Mount Chip Equalizers optimized to offer precise compensation for unwanted gain variation over frequency in an RF signal chain.

The CEX Series of High Frequency Surface Mount Chip Equalizers is designed to offer customers a configurable design approach to get the right solution for specific frequency range and slope, fitting a wide range of requirements up to 40 GHz with a maximum slope of 4dB.

“The CEX series of chip equalizers complements our existing line of SMT high frequency board level components pushing the boundaries of size, weight and power with each new design and expanding our offering for Space, Defence and Communication systems”, says Bruce Valentine, VP of Business Development.

CEX Series of high frequency SMT chip equalizers are a totally passive solution with multiple slope and band options allowing RF designers to reach more precise compensation as the Series offers linear gain equalizers with a positive slope. The product’s uniqueness stands out against competitors with its customization capability in terms of both frequency range and slope.

The CEX Series is suitable for multiple markets and applications and offers :

  • Configurable design approach providing optimized solutions for gain variation over frequency.
  • Multiple slope options (1-4 dB) and excellent slope linearity (±0.25 dB or better).
  • Typical Voltage Standing Wave Ratio at 1.5:1 max and low insertion loss at 1 – 1.25 dB max.
  • Frequency offering up to 40 GHz supporting a wide array of markets and applications.
  • Proven thin and thick film process technology providing small size, lightweight and level of power in a cost-effective, easy-to-implement surface mount solution.
  • Electrical and thermal performances tested through simulation analysis and real-life tests to ensure Series qualification.

A set of design guidelines has been developed that can be used to create tailored solutions for specific application needs.

 

Exciting opportunity for an experienced UK Sales Manager

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Are you an experienced and successful Sales Manager?

Do you have over 5 years’ experience in the Interconnect market?

You may be just what my client is looking for.

I have been engaged by an innovative interconnect company with an international presence to help recruit a UK Sales Manager.

With over 40 years of know-how and experience in the manufacture and development of innovative electrical and electronic interconnect products and solutions this company is now looking to strengthen its senior management team by recruiting a seasoned UK Sales Manager.

The company are now looking to expand and diversify and are looking for a dynamic and experienced UK Sales Manager preferably qualified to degree level or equivalent in a commercial or technical discipline.

The ideal candidate will have over 5 years’ experience of selling and providing interconnect products and solutions to a broad market base and must have the ability to identify and drive the company’s strategy of diversification whilst ensuring the core business continues to be developed. An excellent knowledge of connectors, cabling, power and data is essential as is the ability to see business opportunities outside of the existing portfolio and applications, your demonstrable experience and success in this area will be key.

If you are a self-starter and dynamic sales professional with a can-do attitude and an ability to both work on your own and as part of a team then this may be just the opportunity you are looking for.

This is an exciting opportunity for the right candidate to join the company at a time where it is setting its growth strategy for the next 2-3 years and this in turn will bring opportunity for personal development and greater responsibility.

If you think this exciting opportunity is for you please contact the companies consultant, John Biggs in the first instance via e mail at biggsjo@outlook.com

 

January 2021.